EMAP2019
The 21st Electronic Materials and
Packaging Conference will be held in Korea. The former sixteen conferences in
Singapore (1999), Hong Kong (2000), and Korea (2001), Taiwan (2002), Singapore
(2003), Malaysia(2004), Japan (2005), Hongkong (2006), Korea (2007), Taiwan
(2008), Malaysia (2009), Singapore (2010), Japan (2011), Hong Kong (2012),
Korea (2013), Taiwan (2014), Portland (2015), Malaysia(2016), Japan (2017),
Hong Kong (2018) were very successful. The committee would like to continue to
make this meeting successful.